ARDEX CE 501 Segmental Bonding Adhesive is a 2-component, highly thixotropic epoxy adhesive, specially formulated for bonding and joint sealing post-tensioned precast segments in bridge construction.
Apply ARDEX CE 501 Segmental Bonding Paste to each surface of two bonding segments using a trowel or protected hand. Spread from the top to the bottom in the same direction to a thickness of 1 – 2mm in general, depending on project requirements. Make sure the application is finished within 30 minutes after mixing. Clean up the extruded adhesive from the joint.
Packaging
ARDEX CE 501 is packed in Metal tins – net weight 8kg